this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 1 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 distinctive characteristics mcp features power supply voltage of 2.7 v to 3.3v high performance - 70 ns package - 7 x 9 x 1.2mm 56 ball fbga operating temperature - 25 c to +85 c general description the en71pl series is a product line of stacked multi-chip product (mcp) packages and consists of: en29pl032a (simultaneous read/write) flash memory die. pseudo sram. for detailed specifications, please refer to the individual datasheets listed in the following table. device document nor flash en29pl032a pseudo sram enpsl16 product selector guide 32mb flash memory device-model# en71pl032a0a psram density 16m psram flash access time 70ns psram access time 70ns page read access time 25ns psram page read access time 25ns package 56 fbga en71pl032a base mcp stacked multi-chip product (mcp) flash memory and ram 32 megabit (2m x 16-bit) cmos 3.0 volt-only simultaneous operation page mode flash memory and 16 megabit (1m x 16-bit) pseudo static ram
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 2 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 mcp block diagram
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 3 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 connection diagram mcp flash-only addresses shared addresses en71pl032a0a a20 a19 ? a0 note: a9 = vid for hv autoselect mode is not available for mcp product.
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 4 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 pin description signal description a20?a0 21 address inputs (common) dq15?dq0 16 data inputs/outputs (common) ce1#f chip enable 1 (flash) ce1#ps chip enable 1 (psram) ce2ps chip enable 2 (psram) oe# output enable (common) we# write enable (common) ry/by# ready/busy output (flash) ub# upper byte control (psram) lb# lower byte control (psram) reset# hardware reset pin, active low (flash) wp#/acc hardware write protect/acceleration pin (flash) v cc f flash 3.0 volt-only single power supply v cc ps psram power supply v ss device ground (common) nc pin not connected internally note: a9 = vid for hv autoselect mode is not available for mcp product. logic symbol
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 5 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 purpose eon silicon solution inc. (hereinafter called ?eon ?) is going to provide its products? top marking on ics with < cfeon > from january 1st, 2009, and without any change of the part number and the compositions of the ics. eon is still keeping the promise of quality for all the products with the same as that of eon delivered before. please be advised with the change and appreciate your kindly cooperation and fully support eon?s product family. eon products? top marking cfeon top marking example: for more information please contact your local sales office for additional information about eon memory solutions. cfeon part number: xxxx-xxx lot number: xxxxx date code: xxxxx
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 6 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 ordering information en71pl032 a0 a D 70 c w p packaging content p = rohs compliant temperature range w = wireless (-25 c to +85 c) package c =56-ball fine pitch ball grid array (fbga) 0.80mm pitch, 7mm x 9mm package speed 70 = 70ns a = version identifier psram density a0 = 16m psram base part number en = eon silicon solution inc. 71pl = multi-chip product (mcp) 3.0v simultaneous read/write, page mode flash memory and ram 032 = 32 megabit (2m x 16)
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 7 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 package mechanical 56-ball fine-pitch ball grid array (fbga) 7 x 9 mm package, pitch: 0.8mm, ball: 0.4mm note : controlling dimens ions are in millimeters (mm). min. nor max a - - - - - - 1.20 a1 0.25 0.30 0.35 a2 0. 80 - - - 0.95 d 8.95 9.00 9.05 e 6.95 7.00 7.05 d1 - - - 5.60 - - - e1 - - - 5.60 - - - e - - - 0.80 - - - b 0.35 0.40 0.45 dimension in mm symbol
this data sheet may be revised by subsequent versions ?2004 eon silicon solution, inc., www.eonssi.com or modifications due to changes in technical specifications. 8 en71pl032a0a rev. a, issue date: 2010 / 11 / 15 revisions list revision no description date a initial release 2010/11/15
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